Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C

Shou Chang Cheng, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

Original languageEnglish
Pages (from-to)1795-1803
Number of pages9
JournalJournal of Materials Research
Volume18
Issue number8
DOIs
Publication statusPublished - 2003 Aug

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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