Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C

Shou Chang Cheng, Kwang-Lung Lin

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

Original languageEnglish
Pages (from-to)1795-1803
Number of pages9
JournalJournal of Materials Research
Volume18
Issue number8
DOIs
Publication statusPublished - 2003 Jan 1

Fingerprint

solders
Soldering alloys
Intermetallics
intermetallics
Aging of materials
cracks
Cracks
Growth kinetics
kinetics
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{c1cf3b98e32f4a00ad62ad106850af51,
title = "Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C",
abstract = "The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.{\%}. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.",
author = "Cheng, {Shou Chang} and Kwang-Lung Lin",
year = "2003",
month = "1",
day = "1",
doi = "10.1557/JMR.2003.0249",
language = "English",
volume = "18",
pages = "1795--1803",
journal = "Journal of Materials Research",
issn = "0884-2914",
publisher = "Materials Research Society",
number = "8",

}

Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C. / Cheng, Shou Chang; Lin, Kwang-Lung.

In: Journal of Materials Research, Vol. 18, No. 8, 01.01.2003, p. 1795-1803.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C

AU - Cheng, Shou Chang

AU - Lin, Kwang-Lung

PY - 2003/1/1

Y1 - 2003/1/1

N2 - The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

AB - The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.

UR - http://www.scopus.com/inward/record.url?scp=0141502507&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0141502507&partnerID=8YFLogxK

U2 - 10.1557/JMR.2003.0249

DO - 10.1557/JMR.2003.0249

M3 - Article

VL - 18

SP - 1795

EP - 1803

JO - Journal of Materials Research

JF - Journal of Materials Research

SN - 0884-2914

IS - 8

ER -