TY - JOUR
T1 - Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150°C
AU - Cheng, Shou Chang
AU - Lin, Kwang Lung
N1 - Funding Information:
The financial support of this work from National Science Council of the Republic of China under Project No. NSC-90-2216-E-006-052 is gratefully acknowledged.
PY - 2003/8
Y1 - 2003/8
N2 - The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.
AB - The interfacial intermetallic formation at 150°C between Cu and various solders, including Sn-9Zn, Sn-8.55Zn-1Ag, and Sn-8.55Zn-1Ag-XA1 was investigated. The A1 contents X of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The compositions and the growth kinetics of intermetallic compounds (IMCs) were investigated. The IMC consisted of three layers for Sn-9Zn/Cu, Sn-Zn-Ag/Cu, and Sn-Zn-Ag-XAl/Cu specimens after aging for 100-600 h. These three layers included the Cu3(Zn, Sn) phase adjacent to the solder, the Cu6(Sn, Zn)5 phase in the middle, and the Cu-rich phase near to Cu. For long-term aging time over 1000 h, the Cu6(Sn, Zn)5 phase grew, while the Cu3(Zn, Sn) phase diminished. Al segregation formed in the IMC for all of the Sn-Zn-Ag-XAl/Cu specimens after aging. Cracks formed, when aged for 1000 h, at the solder/IMC interface or within the IMC layer for the following solders: Sn-9Zn, Sn-8.55Zn-1Ag, Sn-8.55Zn-1Ag-0.1Al, Sn-8.55Zn-1Ag-0.25Al, and Sn-8.55Zn-1Ag-0.45Al. The crack was not detected up to 3000 h for the Sn-8.55Zn-1Ag-0.01Al/Cu couple, of which the IMC growth rate was the slowest among all solders.
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U2 - 10.1557/JMR.2003.0249
DO - 10.1557/JMR.2003.0249
M3 - Article
AN - SCOPUS:0141502507
SN - 0884-2914
VL - 18
SP - 1795
EP - 1803
JO - Journal of Materials Research
JF - Journal of Materials Research
IS - 8
ER -