Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

Chiang Ming Chuang, Po Cheng Shi, Kwang-Lung Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds