Interfacial reaction of printed solder bump with UBM

Kwang-Lung Lin, Ming Jin Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work is to investigate the interfacial interaction between the UBM and solder bump produced with print bumping process. The solder bump manufactured with printing by using PI (polyimide) as the patterning mask was investigated for its interfacial reaction with electroless nickel UBM. The solder paste is a 63Sn-37Pb solder with 90% of metal content. The solder powder is of type 5 with particle sizes range from 15 μm to 28 μm. Reflow of the solder paste was conducted at 230°C for 30 sec. The electroless nickel was deposited on Cu electrode of silicon chip. A thin layer of electroless Au was deposited on the electroless nickel to provide wetting property and oxidation resistance for the electroless nickel. The solder bump was tested, respectively, under 150°C and 85°C/85RH for up to 1000 hours. The interdiffusion behavior of the constituent elements Cu, Ni, and Sn across the interface was investigated with elemental line scanning. It was found that the electroless nickel with a thickness of 5 μm functions well as a diffusion barrier for Cu and Sn. No interdiffusion was seen between Cu and Sn after 1000 hours of test under the two testing conditions.

Original languageEnglish
Title of host publicationAdvances in Electronic Materials and Packaging 2001
EditorsS.B. Lee, K.W. Paik
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages146-149
Number of pages4
ISBN (Electronic)0780371577, 9780780371576
DOIs
Publication statusPublished - 2001 Jan 1
Event3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
Duration: 2001 Nov 192001 Nov 22

Publication series

NameAdvances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
CountryKorea, Republic of
CityJeju Island
Period01-11-1901-11-22

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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