Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates

Tsan Hsien Tseng, Chih Han Yang, Jeng Yu Chiang, Jyun Jhe Huang, Chih Hao Chen, Shih-kang Lin, Chang Meng Wang, Albert T. Wu

Research output: Contribution to journalArticle

Abstract

In this study, the interfacial reactions, microstructures, and intermetallic compounds (IMCs)of 68In–32Bi, 50In–50Bi, and 33In–67Bi (in weight percent)low melting alloys reacted with Cu substrates were investigated. CuIn2, Cu11In9, and Cu2In IMCs formed at the interface in different In–Bi/Cu systems and were characterized by grazing incidence X-ray diffraction (GIXRD)and electron probe X-ray microanalyzer (EPMA). The CuIn2 and Cu11In9 IMCs formed at the interface phase transfer to Cu11In9 when annealing temperature was greater than 70 °C. CALPHAD-type thermodynamic calculations were performed to illustrate the corresponding diffusion paths. Moreover, shear tests were conducted and indicated that 50In–50Bi solder joint provide the highest shear strength among the three alloys.

Original languageEnglish
Pages (from-to)506-513
Number of pages8
JournalMaterials Science and Engineering A
Volume759
DOIs
Publication statusPublished - 2019 Jun 24

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Surface chemistry
Intermetallics
intermetallics
Melting
melting
Substrates
Phase interfaces
low weight
shear strength
electron probes
solders
grazing incidence
Shear strength
Soldering alloys
x rays
Thermodynamics
Annealing
shear
X ray diffraction
X rays

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Tseng, Tsan Hsien ; Yang, Chih Han ; Chiang, Jeng Yu ; Huang, Jyun Jhe ; Chen, Chih Hao ; Lin, Shih-kang ; Wang, Chang Meng ; Wu, Albert T. / Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates. In: Materials Science and Engineering A. 2019 ; Vol. 759. pp. 506-513.
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Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates. / Tseng, Tsan Hsien; Yang, Chih Han; Chiang, Jeng Yu; Huang, Jyun Jhe; Chen, Chih Hao; Lin, Shih-kang; Wang, Chang Meng; Wu, Albert T.

In: Materials Science and Engineering A, Vol. 759, 24.06.2019, p. 506-513.

Research output: Contribution to journalArticle

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AU - Tseng, Tsan Hsien

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AU - Huang, Jyun Jhe

AU - Chen, Chih Hao

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AU - Wang, Chang Meng

AU - Wu, Albert T.

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