Interfacial reactions of the Co/Si1-xGex system

Jian Shing Luo, Wen Tai Lin, C. Y. Chang, W. C. Tsai, S. J. Wang

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Thermal reactions of Co(200 Å)/Si0.76Ge0.24(1500 Å)/Si and Co(200 Å)/Si0.54Ge0.46(1000 Å)/Si systems in a vacuum of 1-2 ×10-6 Torr were studied. At temperatures above 200°C Ge segregation appeared even though no suicides and/or germanosilicides were formed. At a temperature of 225-550°C Co(Si1-y,Gey) was formed, in which the Ge concentration was deficient. The formation temperatures of CoSi2 in the Co/Si1-xGex systems, where x = 0.24 and 0.46, were above 575°C, being relatively higher than that in the Co/Si system. At temperatures above 500°C the island structure, Ge segregation to the surface of the exposed Si1-xGex films, and the penetration of reacted layer into the Si substrate occurred. At temperatures above 700°C a SiC layer was grown on the film surface. For the Si0.54Ge0.46 films the penetration of the reacted layer into the Si substrate occurred even at 350°C owing to the wave structure of the as-grown Si0.54Ge0.46 films. A Si layer interposed between Co and Si0.76Ge0.24 films is an effective scheme to grow a continuous CoSi2 contact at 550-600°C without inducing Ge segregation and hence the strain relaxation in the Si0.76Ge0.24 films.

Original languageEnglish
Pages (from-to)140-144
Number of pages5
JournalMaterials Chemistry and Physics
Issue number2
Publication statusPublished - 1997 Jul 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics


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