Analytical expressions of the mode III interfacial stress intensity factor are derived for the edge-cracked problems in bonded semicircles and strips. The results are extracted from the solutions of the bonded finite sector by the conformal mapping method. Based on the method, the stress intensity factors for the problems with various crack lengths are achieved, and two corresponding cases are presented and discussed. The obtained solutions can serve as a reference for related crack problems.
All Science Journal Classification (ASJC) codes
- Computational Mechanics
- Modelling and Simulation
- Mechanics of Materials