Interfacial stress intensity factors for edge-cracked bonded semicircles and strips under out-of-plane shear

Chih Hao Chen, Chien Chung Ke, Chein-Lee Wang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Analytical expressions of the mode III interfacial stress intensity factor are derived for the edge-cracked problems in bonded semicircles and strips. The results are extracted from the solutions of the bonded finite sector by the conformal mapping method. Based on the method, the stress intensity factors for the problems with various crack lengths are achieved, and two corresponding cases are presented and discussed. The obtained solutions can serve as a reference for related crack problems.

Original languageEnglish
Pages (from-to)119-127
Number of pages9
JournalInternational Journal of Fracture
Volume180
Issue number1
DOIs
Publication statusPublished - 2013 Mar 1

All Science Journal Classification (ASJC) codes

  • Computational Mechanics
  • Modelling and Simulation
  • Mechanics of Materials

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