Intermetallic phase on the interface of Ag-Au-Pd/Al structure

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Kuan Jen Chen

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0-1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag 2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd) 2Al with a hexagonal structure.

Original languageEnglish
Article number925768
JournalAdvances in Materials Science and Engineering
Volume2014
DOIs
Publication statusPublished - 2014

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Intermetallics
Wire
Acoustic impedance
Polycrystals
Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

Cite this

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title = "Intermetallic phase on the interface of Ag-Au-Pd/Al structure",
abstract = "Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0-1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag 2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd) 2Al with a hexagonal structure.",
author = "Hsueh, {Hao Wen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Li Hui} and Chen, {Kuan Jen}",
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Intermetallic phase on the interface of Ag-Au-Pd/Al structure. / Hsueh, Hao Wen; Hung, Fei Yi; Lui, Truan Sheng; Chen, Li Hui; Chen, Kuan Jen.

In: Advances in Materials Science and Engineering, Vol. 2014, 925768, 2014.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Intermetallic phase on the interface of Ag-Au-Pd/Al structure

AU - Hsueh, Hao Wen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Li Hui

AU - Chen, Kuan Jen

PY - 2014

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AB - Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0-1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag 2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd) 2Al with a hexagonal structure.

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