Intermittent electroless nickel deposition in a fine trench flip chip bump pad

Kwang Lung Lin, Chih Li Chen

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)


An intermittent electroless nickel deposition process was examined which involved periodically removing and reinserting the silicon wafer in the deposition bath. This process results in electroless nickel deposits with a smooth surface appearance and uniform thickness within the bump opening. The intermittent deposition process also results in enhancement in deposition speed. The benefits of this process are ascribed to replenishment of the surface concentration and the breakdown of entrapped gas bubble in the trench area of bump pad.

Original languageEnglish
Pages (from-to)2604-2606
Number of pages3
JournalJournal of the Electrochemical Society
Issue number7
Publication statusPublished - 2000 Jul

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry


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