Abstract
An intermittent electroless nickel deposition process was examined which involved periodically removing and reinserting the silicon wafer in the deposition bath. This process results in electroless nickel deposits with a smooth surface appearance and uniform thickness within the bump opening. The intermittent deposition process also results in enhancement in deposition speed. The benefits of this process are ascribed to replenishment of the surface concentration and the breakdown of entrapped gas bubble in the trench area of bump pad.
| Original language | English |
|---|---|
| Pages (from-to) | 2604-2606 |
| Number of pages | 3 |
| Journal | Journal of the Electrochemical Society |
| Volume | 147 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 2000 Jul |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Surfaces, Coatings and Films
- Electrochemistry
- Materials Chemistry