Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum

Chun Jen Chen, Kwang Lung Lin

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52 Citations (Scopus)

Abstract

This study investigated the effect of saccharin on the internal stress and the adhesion of amorphous Ni-Cu-P deposited on aluminum. An amorphous Ni-Cu-P deposit with slight compressive stress can be produced when one adds 8-10 g/l saccharin into the Ni-Cu-P deposition solution. The stress relief mechanism was investigated. The addition of saccharin restrains the coalescence of the islands within Ni-Cu-P nodules and reverses the internal stress of the electroless Ni-Cu-P deposit from tensile to compressive. The adhesion strength of the Si/Ti/Al/Ni-Cu-P multilayer specimen obtained with 10 g/l saccharin is around 35 to 45 MPa, and the fracture occurs at the silicon substrate after the pull test. The shear strength of the Ti/Al/Ni-Cu-P bump (100 × 100 μm) on Si is 132.9 ± 12.7 g, and the fracture occurs at the Ni-Cu-P deposit after the shear test. Moreover, the inhibition of coalescence of the fine island within Ni-Cu-P nodules increases the brightness and the hardness of the deposit.

Original languageEnglish
Pages (from-to)106-113
Number of pages8
JournalThin Solid Films
Volume370
Issue number1
DOIs
Publication statusPublished - 2000 Jul 17

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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