Investigation into the mechanical contact behavior of single asperities using static atomistic simulations

Yeau Ren Jeng, Wei Cheng Kao, Ping Chi Tsai

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15 Citations (Scopus)

Abstract

This study employs an atomic-scale model to investigate mechanical contact behaviors of a single asperity, particularly those which take place beyond the elastic limit threshold. The results obtained from the current model are found to be in good agreement with the predictions yielded by continuum theory as the contact behavior of the asperity transits from fully elastic to elastoplastic contact interface. Furthermore, the result shows that adhesion within the single asperity has the negligible influence during the loading stage; however, the adhesion force leads to the sizable clusters of copper atoms on the rigid plate during the unloading stage.

Original languageEnglish
Article number091904
JournalApplied Physics Letters
Volume91
Issue number9
DOIs
Publication statusPublished - 2007

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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