TY - GEN
T1 - Investigation of HfSiOXPassivation Effect on AlGaN/GaN HEMT
AU - Mazumder, Soumen
AU - Wang, Yeong Her
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/3/4
Y1 - 2020/3/4
N2 - AlGaN/GaN-based high electron mobility Transistors (HEMTs) were fabricated on Si substrate. Surface passivation effect on AlGaN/GaN HEMTs was investigated with hafnium silicate (HfSiOx) passivation layer deposited by atomic layer deposition (ALD) at 250 °C. The DC current-voltage characteristics (ID-VD), pulsed ID-VD characteristics, and transfer characteristics of the device were compared before and after passivation. The enhancement of IDMAX and GMMAX with better gate controllability as well as significant reduction of current degradation phenomenon due to the suppression of surface states, was observed in the passivated (HfSiOX) HEMT compared to unpassivated device
AB - AlGaN/GaN-based high electron mobility Transistors (HEMTs) were fabricated on Si substrate. Surface passivation effect on AlGaN/GaN HEMTs was investigated with hafnium silicate (HfSiOx) passivation layer deposited by atomic layer deposition (ALD) at 250 °C. The DC current-voltage characteristics (ID-VD), pulsed ID-VD characteristics, and transfer characteristics of the device were compared before and after passivation. The enhancement of IDMAX and GMMAX with better gate controllability as well as significant reduction of current degradation phenomenon due to the suppression of surface states, was observed in the passivated (HfSiOX) HEMT compared to unpassivated device
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U2 - 10.1109/ISDCS49393.2020.9262998
DO - 10.1109/ISDCS49393.2020.9262998
M3 - Conference contribution
AN - SCOPUS:85099704754
T3 - 3rd International Symposium on Devices, Circuits and Systems, ISDCS 2020 - Proceedings
BT - 3rd International Symposium on Devices, Circuits and Systems, ISDCS 2020 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Symposium on Devices, Circuits and Systems, ISDCS 2020
Y2 - 4 March 2020 through 6 March 2020
ER -