In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx ) films that were deposited at various nitrogen (N2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N2 flow ratio increased. This was because the increase in the N content in the RuN x films inhibited the corrosion and oxidation of the Ru metals.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)