Investigation of the galvanic effect between RuN barriers and Cu seed layers

Chia Yang Wu, Wen-Shi Lee, Shih Chieh Chang, Ying Lang Wang

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx ) films that were deposited at various nitrogen (N2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N2 flow ratio increased. This was because the increase in the N content in the RuN x films inhibited the corrosion and oxidation of the Ru metals.

Original languageEnglish
Article number121803
JournalJapanese Journal of Applied Physics
Volume50
Issue number12
DOIs
Publication statusPublished - 2011 Dec 1

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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