Investigation of the galvanic effect between RuN barriers and Cu seed layers

Chia Yang Wu; Wen-Shi Lee; Shih Chieh Chang; Ying Lang Wang

doi:10.1143/JJAP.50.121803

Investigation of the galvanic effect between RuN barriers and Cu seed layers

Chia Yang Wu, Wen-Shi Lee, Shih Chieh Chang, Ying Lang Wang

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuN_x ) films that were deposited at various nitrogen (N₂) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuN_x films was inhibited with increasing N₂ gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuN_x increased and that of the ruthenium oxide layer decreased as N₂ flow ratio increased. This was because the increase in the N content in the RuN _x films inhibited the corrosion and oxidation of the Ru metals.

Original language	English
Article number	121803
Journal	Japanese Journal of Applied Physics
Volume	50
Issue number	12
DOIs	https://doi.org/10.1143/JJAP.50.121803
Publication status	Published - 2011 Dec 1

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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@article{2ebaf0f8ffc64d5ca740d439c04f5d63,

title = "Investigation of the galvanic effect between RuN barriers and Cu seed layers",

abstract = "In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx ) films that were deposited at various nitrogen (N2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N2 flow ratio increased. This was because the increase in the N content in the RuN x films inhibited the corrosion and oxidation of the Ru metals.",

author = "Wu, {Chia Yang} and Wen-Shi Lee and Chang, {Shih Chieh} and Wang, {Ying Lang}",

year = "2011",

month = dec,

day = "1",

doi = "10.1143/JJAP.50.121803",

language = "English",

volume = "50",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

number = "12",

}

TY - JOUR

T1 - Investigation of the galvanic effect between RuN barriers and Cu seed layers

AU - Wu, Chia Yang

AU - Lee, Wen-Shi

AU - Chang, Shih Chieh

AU - Wang, Ying Lang

PY - 2011/12/1

Y1 - 2011/12/1

N2 - In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx ) films that were deposited at various nitrogen (N2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N2 flow ratio increased. This was because the increase in the N content in the RuN x films inhibited the corrosion and oxidation of the Ru metals.

AB - In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx ) films that were deposited at various nitrogen (N2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N2 flow ratio increased. This was because the increase in the N content in the RuN x films inhibited the corrosion and oxidation of the Ru metals.

UR - http://www.scopus.com/inward/record.url?scp=82955178480&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=82955178480&partnerID=8YFLogxK

U2 - 10.1143/JJAP.50.121803

DO - 10.1143/JJAP.50.121803

M3 - Article

AN - SCOPUS:82955178480

VL - 50

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 12

M1 - 121803

ER -