Investigation of the interfacial reaction between metal and fluorine-contained polyimides

Ching Yu Yang, J. S. Chen, S. L.C. Hsu

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

In this work, thin metal films (Cr and Ta) were deposited on fluorine-contained polyimides, 6FDA-BisAAF, and 6FDA-PPD. The chemical states of the metalpolyimide samples were characterized by using x-ray photoelectron spectroscopy (XPS). XPS analysis reveals that metal- C, C-O, and metal- O bondings are present in metallized 6FDA-BisAAF and 6FDA-PPD. C-F bonds are observed in bare 6FDA-BisAAF and 6FDA-PPD; however, they are not seen in the metallized samples. Disappearance of the C-F bonding is attributed to the disruption of CF3 side groups from the main chains of 6FDA-BisAAF and 6FDA-PPD when the chains are exposed to the plasma during the metal deposition. Nevertheless, the disruption of CF3 side groups also creates sites for the formation of metal- C or C-O bondings, which provide a positive adhesion strength at the metalpolyimide interface, as revealed by the tape test.

Original languageEnglish
Pages (from-to)862-868
Number of pages7
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume23
Issue number4
DOIs
Publication statusPublished - 2005 Jul 1

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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