Investigation of the thermal degradation mechanism for Cu/Au Schottky contacts to the InGaP layer

Day Shan Liu, Ching Ting Lee

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3 Citations (Scopus)


The thermal degradation mechanism of Cu/Au contacts to the InGaP layer has been investigated using current-voltage measurement, x-ray diffractometry (XRD) measurement and cross-sectional transmission electron microscopy with energy dispersive x-ray spectroscopy (EDS). The diffraction peaks of Cu, Au, and InGaP could be observed from the XRD measurement and an evident interface of Cu/InGaP also could be found from the cross-sectional microstructure. The apparent interface of Cu/InGaP was responsible for the high performance of Cu/Au Schottky contacts to the InGaP layer. The thermal stability endurance for the high performance of the Schottky contact can be maintained up to 450°C. However, the Schottky contact performance became inferior at temperatures higher than 450°C. At a temperature of 500°C, the peaks of Cu and Au disappeared, the XRD measurement revealing the diffraction peaks of CuP 2 and Cu 3Au 2 alloys. According to the cross-sectional microstructure and the EDS measurements at 500°C, the Cu layer had been released, penetrated into the InGaP layer, and outdiffused to the Au layer to form an intermetallic layer. As a result, the thermal degradation mechanism is attributed to the release of the Cu layer and the indiffusion of Cu element to the InGaP layer.

Original languageEnglish
Pages (from-to)1349-1353
Number of pages5
JournalJournal of Applied Physics
Issue number3
Publication statusPublished - 2002 Feb 1

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

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