Investigation of thermosonic wire bonding resistance of gold wire onto copper pad

Yeau-Ren Jeng, Sang Mao Chiu, Pay Yau Huang, Shiuh Hwa Shyu

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance.

Original languageEnglish
Article number5371827
Pages (from-to)65-70
Number of pages6
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume33
Issue number1
DOIs
Publication statusPublished - 2010 Jan 1

Fingerprint

Gold
Wire
Contact resistance
Copper
Oxide films
Networks (circuits)
Shielding
Argon
Silver
Ultrasonics
Gases

All Science Journal Classification (ASJC) codes

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

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Investigation of thermosonic wire bonding resistance of gold wire onto copper pad. / Jeng, Yeau-Ren; Chiu, Sang Mao; Huang, Pay Yau; Shyu, Shiuh Hwa.

In: IEEE Transactions on Electronics Packaging Manufacturing, Vol. 33, No. 1, 5371827, 01.01.2010, p. 65-70.

Research output: Contribution to journalArticle

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