Abstract
This paper discusses the electric performance for thermosonic wire bonding of gold wire onto copper pads. Various methods normally used to improve bondability were investigated including the bare copper pads with argon shielding gas and the copper pads with cupric oxide film, cuprous oxide film, and silver film. The micro-contact theory was used to determine the effective contact area. The circuit contact resistance was measured for each sample and was presented in terms of ultrasound power and effective contact area. The results show that the increase in the effective contact area leads to a lower circuit contact resistance before reaching a minimum value, and further increase in the effective contact area would not have noticeable effect on the resistance.
Original language | English |
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Article number | 5371827 |
Pages (from-to) | 65-70 |
Number of pages | 6 |
Journal | IEEE Transactions on Electronics Packaging Manufacturing |
Volume | 33 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2010 Jan |
All Science Journal Classification (ASJC) codes
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering