Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package

Engineering

• Nitride 100%
• Intermetallics 100%
• Mechanical Stress 50%
• Simulation Result 50%
• Major Factor 50%
• Shear Strength 50%
• Thermal Stress 50%
• VLSI Circuits 50%
• Semiconductor Device 50%
• Reliability Issue 50%

Keyphrases

• Pitch Configurations 20%
• Gold Materials 20%
• Corner Rounding 20%