Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Jenn Ming Song, Fang I. Li, Truan Sheng Lui, Li Hui Chen

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

This study investigated the vibration fracture properties of Sn-Ag-Cu alloys with various Cu contents. Results show that the microstructure becomes finer with a higher Cu content. This leads to a lower damping capacity, higher deflection amplitude, and thus inferior vibration fracture resistance under a constant vibration force. It is of interest that when the Cu content reaches 1.5 wt%, the specimen possesses the highest damping capacity and greatest vibration life. The presence of massive primary Cu6Sn5 intermetallics probably accounts for this phenomenon.

Original languageEnglish
Pages (from-to)2665-2673
Number of pages9
JournalJournal of Materials Research
Volume19
Issue number9
DOIs
Publication statusPublished - 2004 Sep 1

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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