Investigation the electroplating behavior of self formed cumn barrier

Chia Yang Wu, Wen-Shi Lee, Shih Chieh Chang, Ying Lang Wang

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The electrical and material properties of Copper (Cu) mixed with [0̃10 atomic% manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO 2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5%, but increase with the rise in the Mn content higher than 5%. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.

Original languageEnglish
Pages (from-to)5800-5806
Number of pages7
JournalJournal of Nanoscience and Nanotechnology
Volume13
Issue number8
DOIs
Publication statusPublished - 2013 Aug 1

Fingerprint

Electroplating
electroplating
Manganese
manganese
Copper
Silicon
copper
impedance
Dielectric Spectroscopy
Corrosion
Silicon oxides
silicon oxides
Electric Impedance
Electrochemical impedance spectroscopy
plating
Interfacial energy
Plating
Oxides
surface energy
Surface morphology

All Science Journal Classification (ASJC) codes

  • Medicine(all)

Cite this

Wu, Chia Yang ; Lee, Wen-Shi ; Chang, Shih Chieh ; Wang, Ying Lang. / Investigation the electroplating behavior of self formed cumn barrier. In: Journal of Nanoscience and Nanotechnology. 2013 ; Vol. 13, No. 8. pp. 5800-5806.
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abstract = "The electrical and material properties of Copper (Cu) mixed with [0̃10 atomic{\%} manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO 2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5{\%}, but increase with the rise in the Mn content higher than 5{\%}. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.",
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Investigation the electroplating behavior of self formed cumn barrier. / Wu, Chia Yang; Lee, Wen-Shi; Chang, Shih Chieh; Wang, Ying Lang.

In: Journal of Nanoscience and Nanotechnology, Vol. 13, No. 8, 01.08.2013, p. 5800-5806.

Research output: Contribution to journalArticle

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AB - The electrical and material properties of Copper (Cu) mixed with [0̃10 atomic% manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO 2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5%, but increase with the rise in the Mn content higher than 5%. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.

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