Abstract Zn-25Sn based alloys possess great potential as candidates for high temperature lead-free solders. But it exhibits poor oxidation resistance due to the high Zinc content. This study selected Pr (0.01-0.08 wt%) and Al (0.01-0.25 wt%) as alloying elements to improve the wetting performance of Zn-25Sn based solder alloy. It was found that the addition of 0.01 wt% Pr increased the wetting force. However, dewetting was observed under air atmosphere for the Zn-25Sn, Pr-containing solder, and solder containing 0.01% Al. It was also be found that the dewetting of Pr-containing solder could be avoided under argon atmosphere as well as with higher Al addition.
All Science Journal Classification (ASJC) codes
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry