Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient

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Abstract

Abstract Zn-25Sn based alloys possess great potential as candidates for high temperature lead-free solders. But it exhibits poor oxidation resistance due to the high Zinc content. This study selected Pr (0.01-0.08 wt%) and Al (0.01-0.25 wt%) as alloying elements to improve the wetting performance of Zn-25Sn based solder alloy. It was found that the addition of 0.01 wt% Pr increased the wetting force. However, dewetting was observed under air atmosphere for the Zn-25Sn, Pr-containing solder, and solder containing 0.01% Al. It was also be found that the dewetting of Pr-containing solder could be avoided under argon atmosphere as well as with higher Al addition.

Original languageEnglish
Article number34592
Pages (from-to)852-858
Number of pages7
JournalJournal of Alloys and Compounds
Volume646
DOIs
Publication statusPublished - 2015 Jul 6

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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