Investigations of TiO2-AlGaN/GaN/Si-passivated HFETs and MOS-HFETs using ultrasonic spray pyrolysis deposition

Ching Sung Lee, Wei Chou Hsu, Bo Yi Chou, Han Yin Liu, Cheng Long Yang, Wen Ching Sun, Sung Yen Wei, Sheng Min Yu, Chang Luen Wu

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26 Citations (Scopus)


Comparative studies for TiO2-passivated Al0.25Ga0.75N/GaN heterostructure FETs (HFETs) and TiO2-dielectric MOS-HFETs using nonvacuum ultrasonic spray pyrolysis deposition technique are made. Optimum device performances are obtained by tuning the layer thickness of TiO2 to 20 nm. High relative permittivity (k) of 53.6 and thin effective oxide thickness of 1.45 nm are also obtained. Pulse-IV, Hooge coefficient (α H), Transmission Electron Microscopy, and atomic force microscope have been performed to characterize the interface, atomic composition, and surface flatness of the TiO2 oxide. Superior improvements for the present TiO2-dielectric MOS-HFET/TiO2-passivated HFETs are obtained, including 47.6%/23.8% in two-terminal gate-drain breakdown voltage (BV GD), 111%/22.2% in two-terminal gate-drain turn-ON voltage (VON), 47.9%/39.4% in ON-state breakdown (BVDS), 12.2%/10.2% in drain-source current density (IDS at VGS) = 0V (IDSS0), 27.2%/11.7% in maximum IDS (IDS, max), 3/1-order enhancement in on/off current ratio (IONIOFF), 58.8%/17.6% in gate-voltage swing linearity, 25.1%/13.2% in unity-gain cutoff frequency (fT), 40.6%/24.7% in maximum oscillation frequency (fmax), and 33.8%/15.6% in power-added efficiency with respect to a Schottky-gated HFET fabricated on the identical epitaxial structure. The present MOS-HFET has also shown stable electrical performances when the ambient temperature is varied from 300 to 450 K.

Original languageEnglish
Article number7073640
Pages (from-to)1460-1466
Number of pages7
JournalIEEE Transactions on Electron Devices
Issue number5
Publication statusPublished - 2015 May 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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