The soldification of a subcooled-metallic sphere is analyzed by an enthalpy method. During recalescence, enormous rates of growth and internal heat transfer exist until the subcooling of the liquid is eliminated by the heat of fusion. After recalescence, external heat transfer controls the rate of solidification. Moreover, the effects of interface kinetics on the solidification process are examined. Both the exponential and linear kinetic models are considered. It is found that kinetic effect is only important during the recalescence and final transient periods. The total solidification times differ very little whether or not the kinetic effect is included.
|Number of pages||7|
|Journal||Chung-Kuo Chi Hsueh Kung Ch'eng Hsueh Pao/Journal of the Chinese Society of Mechanical Engineers|
|Publication status||Published - 1986 Apr 1|
All Science Journal Classification (ASJC) codes
- Mechanical Engineering