Is 3D integration the way out of the crossroads?

Ding Ming Kwai, Yung Fa Chou, Cheng Wen Wu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In the past few years, we have witnessed the energy crisis and the financial tsunami that played an unwanted duo, changing the world in many aspects that affect most of us. Like many others, the semiconductor industry is trying to recover from the depression triggered by the duo. While companies are working hard in getting out of the slump, many research organizations are rethinking how their R&D budget should be invested. We consider three-dimensional (3D) integration based on the through-silicon-via (TSV) technology a cost-effective way to explore new applications in the future, alleviating the fast growing development cost of system-on-chip (SOC) products. However, there are technical problems to be solved and business models to be established before the industry is ready for manufacturing TSV-based 3D integrated devices. In this paper, we will first give an overview of the status of the worldwide semiconductor industry, identifying challenges and trends, which somewhat justifies our focus on 3D integration. We will then discuss the design and test issues, and some solutions for 3D integrated devices. We will propose approaches from our work at ITRI and NTHU.

Original languageEnglish
Title of host publication2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
Pages1-4
Number of pages4
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010 - Beijing, China
Duration: 2010 Nov 82010 Nov 10

Publication series

Name2010 IEEE Asian Solid-State Circuits Conference, A-SSCC 2010

Conference

Conference2010 6th IEEE Asian Solid-State Circuits Conference, A-SSCC 2010
CountryChina
CityBeijing
Period10-11-0810-11-10

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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