The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering