Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

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Abstract

The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

Original languageEnglish
Article number138323
JournalMaterials Science and Engineering A
Volume765
DOIs
Publication statusPublished - 2019 Sep 23

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solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness
microstructure
Microstructure
microhardness
Tensile properties
Temperature
Refining
Ductility
Solid solutions
tensile properties
refining
Tensile strength
ductility
tensile strength
casts
solid solutions

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

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title = "Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders",
abstract = "The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.",
author = "Lin, {Jeng Chi} and Liang, {Chien Lung} and Lin, {Kwang Lung}",
year = "2019",
month = "9",
day = "23",
doi = "10.1016/j.msea.2019.138323",
language = "English",
volume = "765",
journal = "Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing",
issn = "0921-5093",
publisher = "Elsevier BV",

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TY - JOUR

T1 - Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

AU - Lin, Jeng Chi

AU - Liang, Chien Lung

AU - Lin, Kwang Lung

PY - 2019/9/23

Y1 - 2019/9/23

N2 - The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

AB - The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

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