Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

Jeng Chi Lin; Chien Lung Liang; Kwang Lung Lin

doi:10.1016/j.msea.2019.138323

Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

Jeng Chi Lin, Chien Lung Liang, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

7 Citations (Scopus)

Abstract

The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

Original language	English
Article number	138323
Journal	Materials Science and Engineering A
Volume	765
DOIs	https://doi.org/10.1016/j.msea.2019.138323
Publication status	Published - 2019 Sept 23

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.msea.2019.138323

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title = "Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders",

abstract = "The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.",

author = "Lin, {Jeng Chi} and Liang, {Chien Lung} and Lin, {Kwang Lung}",

note = "Funding Information: The authors gratefully appreciate the financial support for the conduct of this research provided by the Ministry of Science and Technology, Taiwan under a grant number of MOST107-2221-E-006-014-MY3 . Publisher Copyright: {\textcopyright} 2019 Elsevier B.V.",

year = "2019",

month = sep,

day = "23",

doi = "10.1016/j.msea.2019.138323",

language = "English",

volume = "765",

journal = "Materials Science and Engineering A",

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T1 - Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

AU - Lin, Jeng Chi

AU - Liang, Chien Lung

AU - Lin, Kwang Lung

N1 - Funding Information: The authors gratefully appreciate the financial support for the conduct of this research provided by the Ministry of Science and Technology, Taiwan under a grant number of MOST107-2221-E-006-014-MY3 . Publisher Copyright: © 2019 Elsevier B.V.

PY - 2019/9/23

Y1 - 2019/9/23

N2 - The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

AB - The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

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Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

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