Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

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Abstract

The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

Original languageEnglish
Article number138323
JournalMaterials Science and Engineering A
Volume765
DOIs
Publication statusPublished - 2019 Sep 23

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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