Large-scale nanotwins in Cu films/Cu nanowires via stress engineering by a high-energy ion beam bombardment process: Growth and characterization

Tsung Cheng Chan, Yu Ze Chen, Yu Lun Chueh, Chien Neng Liao

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

Dense nanoscale twins were introduced into Cu films and nanowires through bombardment with high-energy Ar+ ions at low temperatures. Both the twin boundary density and indentation hardness of the ion-irradiated Cu films increased with decreases in the bombardment temperature. The improved mechanical strength in the ion-irradiated Cu films is attributed to twin boundary-dislocation and dislocation -dislocation interactions. The strengthened region is several hundreds of nanometers beneath the surface of the bombarded nanowires and thin strips. A mechanism based on irradiation-induced thermal spike cascades is proposed to explain the influence of the energy of the Ar+ ions and bombardment temperature on nanoscale twinning in crystalline Cu. This study provides a route to developing advanced interconnection technology for micro- and nanoelectronic devices.

Original languageEnglish
Pages (from-to)9805-9812
Number of pages8
JournalJournal of Materials Chemistry C
Volume2
Issue number46
DOIs
Publication statusPublished - 2014 Dec 14

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Materials Chemistry

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