Laser ablation of silicon using a Bessel-like beam generated by a subwavelength annular aperture structure

Yuh Yan Yu, Chin Kai Chang, Ming Wei Lai, Long Sun Huang, Chih Kung Lee

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

Using a femtosecond laser incident to an oxide-metal-oxide film engraved with a subwavelength annular aperture (SAA) structure, we generated a Bessel-like beam to ablate silicon. Experimental results show that the silicon can be ablated with a 0.05 J=cm2 input ablation threshold at 120 fs pulse duration. We obtained a surface hole possessing a diameter less than 1μm. Optical performance, including depth-of-focus and focal spot of the SAA structure, were simulated using finite-different time-domain calculations. We found that a far-field laser beam propagating through a SAA structure possesses a submicrometer focal spot and high focus intensity. Our method can be easily adopted for surface machining in microfabrication applications.

Original languageEnglish
Pages (from-to)6384-6390
Number of pages7
JournalApplied optics
Volume50
Issue number34
DOIs
Publication statusPublished - 2011 Dec 1

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Engineering (miscellaneous)
  • Electrical and Electronic Engineering

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