Liquidus projection and solidification of the Sn-In-Cu ternary alloys

Shih Kang Lin, Ching Feng Yang, Shyr Harn Wu, Sinn Wen Chen

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Abstract

Sn-In alloys are promising low-melting-point Pb-free solders. Knowledge of the ternary Sn-In-Cu liquidus projection is important for Sn-In solder applications. Sn-In-Cu ternary alloys were prepared and their primary solidification phases and phase-transformation temperatures during heating were determined. The liquidus projection of the Sn-In-Cu ternary system was determined based on the primary solidification phase at different compositional regimes, the phase-transformation temperatures of the ternary alloys, the phase boundaries and reaction temperatures of the constituent binary systems, and the available ternary Sn-In-Cu data in the literature. No ternary compound was found in the as-cast alloys. The Sn-In-Cu liquidus projection has 11 primary solidification phase regions and seven ternary invariant reactions with the liquid phase, and η-(Cu 6Sn 5,Cu 2In) has a very large compositional regime as the primary solidification phase. A very interesting phenomenon that was also observed is that the solidification paths of some Sn-In-Cu alloys surpass the liquidus trough after their intersections.

Original languageEnglish
Pages (from-to)498-506
Number of pages9
JournalJournal of Electronic Materials
Volume37
Issue number4
DOIs
Publication statusPublished - 2008 Apr

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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