TY - GEN
T1 - Low azeotropic solvent sealing of PMMA microfluidic devices
AU - Lin, Che Hsin
AU - Fu, Lung Ming
AU - Tsai, Chien Hsiung
AU - Chao, Chien Hsiang
AU - Lan, Che Wei
PY - 2005/11/9
Y1 - 2005/11/9
N2 - A new method for sealing PMMA-based microfluidic devices utilizing low azeotropic solvent, named DE-20, is developed. The bonding process can be achieved in 7 min at room temperature and can successfully bond microchannels as small as 40 μm in width without clogging. Results show the bonding strength and the increased roughness of the surface after the bonding process are 3.8 ±0.31 MPa (n = 8) and 10 nm respectively. The achieved bonding strength is 17-fold larger than the conventional thermal bonding. Furthermore, the proposed method can seal a 3-mm wide microfluidic channel without collapsing the channels since no heating process is required in the bonding process. The bonding performance is confirmed by using a zigzag type passive microfluidic mixer. Results present a high mixing efficiency can be achieved under a high driven pressure. More importantly, no leakage is observed under such high pressure.
AB - A new method for sealing PMMA-based microfluidic devices utilizing low azeotropic solvent, named DE-20, is developed. The bonding process can be achieved in 7 min at room temperature and can successfully bond microchannels as small as 40 μm in width without clogging. Results show the bonding strength and the increased roughness of the surface after the bonding process are 3.8 ±0.31 MPa (n = 8) and 10 nm respectively. The achieved bonding strength is 17-fold larger than the conventional thermal bonding. Furthermore, the proposed method can seal a 3-mm wide microfluidic channel without collapsing the channels since no heating process is required in the bonding process. The bonding performance is confirmed by using a zigzag type passive microfluidic mixer. Results present a high mixing efficiency can be achieved under a high driven pressure. More importantly, no leakage is observed under such high pressure.
UR - http://www.scopus.com/inward/record.url?scp=27544489405&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=27544489405&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:27544489405
SN - 0780389948
T3 - Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
SP - 944
EP - 947
BT - TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
T2 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Y2 - 5 June 2005 through 9 June 2005
ER -