Low azeotropic solvent sealing of PMMA microfluidic devices

Che Hsin Lin, Lung Ming Fu, Chien Hsiung Tsai, Chien Hsiang Chao, Che Wei Lan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A new method for sealing PMMA-based microfluidic devices utilizing low azeotropic solvent, named DE-20, is developed. The bonding process can be achieved in 7 min at room temperature and can successfully bond microchannels as small as 40 μm in width without clogging. Results show the bonding strength and the increased roughness of the surface after the bonding process are 3.8 ±0.31 MPa (n = 8) and 10 nm respectively. The achieved bonding strength is 17-fold larger than the conventional thermal bonding. Furthermore, the proposed method can seal a 3-mm wide microfluidic channel without collapsing the channels since no heating process is required in the bonding process. The bonding performance is confirmed by using a zigzag type passive microfluidic mixer. Results present a high mixing efficiency can be achieved under a high driven pressure. More importantly, no leakage is observed under such high pressure.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages944-947
Number of pages4
Publication statusPublished - 2005 Nov 9
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume1

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05-06-0505-06-09

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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