Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application

Research output: Contribution to journalArticle

Abstract

The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.

Original languageEnglish
Article number550
JournalMicromachines
Volume10
Issue number8
DOIs
Publication statusPublished - 2019 Aug 1

Fingerprint

Soldering alloys
Intermetallics
Solar cells
Solid solutions
Electrons

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

@article{a0f5dab314e84cd9a9dd65580dd2ffc4,
title = "Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application",
abstract = "The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9{\%}. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.",
author = "Chen, {Kuan Jen} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Lin Hsu",
year = "2019",
month = "8",
day = "1",
doi = "10.3390/mi10080550",
language = "English",
volume = "10",
journal = "Micromachines",
issn = "2072-666X",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "8",

}

Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application. / Chen, Kuan Jen; Hung, Fei Yi; Lui, Truan Sheng; Hsu, Lin.

In: Micromachines, Vol. 10, No. 8, 550, 01.08.2019.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Low conductivity decay of Sn-0.7Cu-0.2Zn photovoltaic ribbons for solar cell application

AU - Chen, Kuan Jen

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Hsu, Lin

PY - 2019/8/1

Y1 - 2019/8/1

N2 - The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.

AB - The present study applied Sn-0.7Cu-0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu6Sn5 and Ag3Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu-Zn solid-solution layer (Zn accumulation layer) existed at the Cu/solder interface. After a 72 h current stress, no detectable amounts of Cu6Sn5 were found. However, a small increase in Ag3Sn was found. Compared with a Sn-0.7Cu photovoltaic module, the increase of the intermetallic compounds thickness in the Sn-0.7Cu-0.2Zn photovoltaic module was much smaller. A retard in the growth of the intermetallic compounds caused the series resistance of the module to slightly increase by 9%. A Zn accumulation layer formed at the module interfaces by adding trace Zn to the Sn-0.7Cu solder, retarding the growth of the intermetallic compounds and thus enhancing the lifetime of the photovoltaic module.

UR - http://www.scopus.com/inward/record.url?scp=85070978835&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85070978835&partnerID=8YFLogxK

U2 - 10.3390/mi10080550

DO - 10.3390/mi10080550

M3 - Article

AN - SCOPUS:85070978835

VL - 10

JO - Micromachines

JF - Micromachines

SN - 2072-666X

IS - 8

M1 - 550

ER -