Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy

Hann Jang Hwang, Su Wen Hsu, Chia Lung Chung, Chun Shan Wang

Research output: Contribution to journalReview articlepeer-review

36 Citations (Scopus)

Abstract

Dicyclopentadiene-containing low molecular weight poly(phenylene oxide) (PPO) novolac (DCPD-PPO) was prepared by redistributing regular PPO with dicyclopentadiene phenol novolac (DCPDNO), using benzoyl peroxide (BPO) as an initiator in toluene. The synthesized dicyclopentadiene-containing redistributed-PPO novolac (DCPD-PPO) with terminal phenolic hydroxyl group and low molecular weight was used in the modification of dicyclopentadiene containing epoxy (DCPD-epoxy)/4,4′-diamino-diphenylmethane (DDM) network system. The thermal and dielectric properties of the cured DCPD-PPO/DCPD-epoxy system were compared with those of bisphenol A containing DCPD-PPO/BPA-epoxy or BPA-PPO/DCPD-epoxy systems. In addition to, a higher glass transition temperature and thermal stability, the cured DCPD-PPO/DCPD-epoxy resins exhibit lower dielectric constant, dissipation factor, coefficient of thermal expansion and moisture absorption than those of bisphenol A based redistributed-PPO/epoxy.

Original languageEnglish
Pages (from-to)1185-1193
Number of pages9
JournalReactive and Functional Polymers
Volume68
Issue number8
DOIs
Publication statusPublished - 2008 Aug 1

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Environmental Chemistry
  • Biochemistry
  • Chemical Engineering(all)
  • Polymers and Plastics
  • Materials Chemistry

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