Low-Power MCU with Embedded ReRAM Buffers as Sensor Hub for IoT Applications

Tsai Kan Chien, Lih-Yih Chiou, Shyh Shyuan Sheu, Jing Cian Lin, Chang Chia Lee, Tzu Kun Ku, Ming Jinn Tsai, Chih I. Wu

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

This paper proposes embedding 256 Kb resistive random-Access memory (ReRAM) in a microcontroller unit as a data buffer for communicating with a stand-Alone flash memory. In this study, the chip was manufactured using a combination of the TSMC 0.18 \mu{\rm m} process and the Industrial Technology Research Institute ReRAM back-end-of-line process. The ReRAM was equipped with a novel sense amplifier that had three magnification times for the reference cell current for increasing the read yield by 32%. Furthermore, the ReRAM controller included built-in self-Test, built-in self-repair, a shortened Bose-Chaudhuri-Hocquenghem (99, 64, 5) error-correlating code, and asymmetric coding can yield ReRAM up to approximately 100%. When compared with the conventional dynamic random-Access memory (DRAM) buffer, the proposed architecture reduces the system execution time by 25% and the power consumption by 15% at 25 MHz. Simulations also showed that the ReRAM buffering runs at least 51% faster when compared with the use of other nonvolatile memories such as ferroelectric RAM, phase change RAM, and conduct-bridge RAM. Although ReRAM buffering is just competitive in speed and power consumption of spin-Transfer torque magnetorresistive RAM buffering, ReRAM has clear advantages in area, cost, and reliability.

Original languageEnglish
Article number7453196
Pages (from-to)247-257
Number of pages11
JournalIEEE Journal on Emerging and Selected Topics in Circuits and Systems
Volume6
Issue number2
DOIs
Publication statusPublished - 2016 Jun 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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