Low sintering temperature nano-silver pastes with high bonding strength by adding silver 2-ethylhexanoate

Steve Lien Chung Hsu; Yen Ting Chen; Meng Liang Chen; In Gann Chen

doi:10.3390/ma14205941

Low sintering temperature nano-silver pastes with high bonding strength by adding silver 2-ethylhexanoate

Steve Lien Chung Hsu, Yen Ting Chen, Meng Liang Chen, In Gann Chen

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250^◦ C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10⁻⁷ Ω·m, and the shear strength was 57.48 MPa.

Original language	English
Article number	5941
Journal	Materials
Volume	14
Issue number	20
DOIs	https://doi.org/10.3390/ma14205941
Publication status	Published - 2021 Oct 1

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics

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title = "Low sintering temperature nano-silver pastes with high bonding strength by adding silver 2-ethylhexanoate",

abstract = "A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250◦ C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω·m, and the shear strength was 57.48 MPa.",

author = "Hsu, {Steve Lien Chung} and Chen, {Yen Ting} and Chen, {Meng Liang} and Chen, {In Gann}",

note = "Funding Information: Funding: This research was funded by the Ministry of Science and Technology (Taiwan, ROC) through project MOST 110-2124-M-006-003. Publisher Copyright: {\textcopyright} 2021 by the authors. Licensee MDPI, Basel, Switzerland.",

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doi = "10.3390/ma14205941",

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AU - Hsu, Steve Lien Chung

AU - Chen, Yen Ting

AU - Chen, Meng Liang

AU - Chen, In Gann

N1 - Funding Information: Funding: This research was funded by the Ministry of Science and Technology (Taiwan, ROC) through project MOST 110-2124-M-006-003. Publisher Copyright: © 2021 by the authors. Licensee MDPI, Basel, Switzerland.

PY - 2021/10/1

Y1 - 2021/10/1

N2 - A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250◦ C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω·m, and the shear strength was 57.48 MPa.

AB - A silver precursor (silver 2-ethylhexanoate) and silver nanoparticles were synthesized and used to prepare a low sintering temperature nano-silver paste (PM03). We optimized the amount of silver 2-ethylhexanoate added and the sintering temperature to obtain the best performance of the nano-silver paste. The relationship between the microstructures and properties of the paste was studied. The addition of silver 2-ethylhexanoate resulted in less porosity, leading to lower resistivity and higher shear strength. Thermal compression of the paste PM03 at 250◦ C with 10 MPa pressure for 30 min was found to be the proper condition for copper-to-copper bonding. The resistivity was (3.50 ± 0.02) × 10−7 Ω·m, and the shear strength was 57.48 MPa.

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Low sintering temperature nano-silver pastes with high bonding strength by adding silver 2-ethylhexanoate

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All Science Journal Classification (ASJC) codes

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