Magnetic effect during copper electroplating using electrochemical impedance spectroscopy

Chi Cheng Hung, Wen-Shi Lee, Shih Chieh Chang, Gwo Jen Hwang, Ying Lang Wang

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

In this paper, the effect of the intensity of the magnetic field on copper electroplating was investigated. Our results indicate that the variation of the magnetic field on the surface of the cathode electrode affected the electroplating rate of the electroplated copper film. By increasing the intensity of the magnetic field, the copper-electroplating rate increases. However, the magnetic field did not affect the grain sizes or shapes of the copper electroplated films. Electrochemical impedance spectroscopy (EIS) was used to analyze the electrochemical effect of the magnetic field during the copper electroplating process. Cyclic-voltammetry stripping, and cell voltage versus plating time were examined to clarify the acceleration behavior of the magnetic field. The proposed equivalent circuit shows that the magnetic field enhanced the copper-electroplating rate by decreasing the charge-transfer resistance as well as the resistance of the diffusion layer.

Original languageEnglish
Article number076506
JournalJapanese Journal of Applied Physics
Volume48
Issue number7 PART 1
DOIs
Publication statusPublished - 2009 Jul 1

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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