Bi-directional polyimide (PI) electromagnetic microactuator with different geometries are designed, fabricated and tested. Fabrication of the electromagnetic microactuator consists of 10 μm thick Ni/Fe (80/20) permalloy deposition on the PI diaphragm by electroplating, high aspect ratio electroplating of copper planar coil with 10 μm in thickness, bulk micromachining, and excimer laser selective ablation. They were fabricated by a novel concept avoiding the etching selectivity and residual stress problems during wafer etching. A mathematical model is created by ANSYS software to analyze the microactuator. The external magnetic field intensity (H ext) generated by the planar coil is simulated by ANSYS software. ANSYS software is used to predict the deflection angle of the microactuator. Besides, to provide bi-directional and large deflection angle of microactuator, hard magnet Fe/Pt is deposited at a low temperature of 300°C by sputtering onto the PI diaphragm to produce a perpendicular magnetic anisotropic field. This magnetic field can enhance the interaction with Hext to induce attractive and repulsive bi-directional force to provide large displacement. The results of magnetic microactuator with and without hard magnets are compared and discussed. The preliminary result reveals that the electromagnetic microactuator with hard magnet shows a greater deflection angle than that without one.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics