Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si

Kwang Lung Lin; Kun Tzu Hsu

doi:10.1109/6144.888849

Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si

Kwang Lung Lin, Kun Tzu Hsu

Research output: Contribution to journal › Article

12 Citations (Scopus)

Abstract

This work attempted to fabricate the solder bump of the structure: Si/Ti/Cu/Electroless Ni/Solder. The shearing strength of the solder bump, with bump pad of 60 μm in diameter, is around 15 g/bump prior to and after reflow. The solder bumps fractured at the solder. Humidity test at 85% of relative humidity at 85°C and a high temperature treatment at 150°C for 1000 h tend to downgrade the shearing strength of the solder portion of the bump, yet not the interface. Both treatments enhance the growth of intermetallic compound (IMC) formed between Ni and solder. The barrier effect of electroless nickel deposit was investigated.

Original language	English
Pages (from-to)	657-660
Number of pages	4
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	4
DOIs	https://doi.org/10.1109/6144.888849
Publication status	Published - 2000 Dec

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/6144.888849

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Lin, K. L., & Hsu, K. T. (2000). Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si. IEEE Transactions on Components and Packaging Technologies, 23(4), 657-660. https://doi.org/10.1109/6144.888849

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