Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si

Kwang Lung Lin, Kun Tzu Hsu

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

This work attempted to fabricate the solder bump of the structure: Si/Ti/Cu/Electroless Ni/Solder. The shearing strength of the solder bump, with bump pad of 60 μm in diameter, is around 15 g/bump prior to and after reflow. The solder bumps fractured at the solder. Humidity test at 85% of relative humidity at 85°C and a high temperature treatment at 150°C for 1000 h tend to downgrade the shearing strength of the solder portion of the bump, yet not the interface. Both treatments enhance the growth of intermetallic compound (IMC) formed between Ni and solder. The barrier effect of electroless nickel deposit was investigated.

Original languageEnglish
Pages (from-to)657-660
Number of pages4
JournalIEEE Transactions on Components and Packaging Technologies
Volume23
Issue number4
DOIs
Publication statusPublished - 2000 Dec

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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