Measurement of adhesive force between two mica surfaces with multiple beam interferometry

T. Y. Chen, J. C. Jung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Surface forces play a crucial role in the contact behavior of micro-components as well as the application of MEMS products. In this study, a microscopic measurement system based on multiple beam interferometry is developed to measure the adhesive force between two mica thin films. The contact area on the mica can be determined from the FECO fringes. A double cantilever spring is used to measure the adhesive (pull-off) forces between the two mica thin films. The usefulness of the adhesive force measurement system is validated by comparing with the result from JKR contact theory.

Original languageEnglish
Title of host publicationMEMS and Nanotechnology - Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics
PublisherSpringer New York LLC
Pages197-201
Number of pages5
ISBN (Print)9781441988249
DOIs
Publication statusPublished - 2011 Jan 1

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
Volume2
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

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