Surface forces play a crucial role in the contact behavior of micro-components as well as the application of MEMS products. In this study, a microscopic measurement system based on multiple beam interferometry is developed to measure the adhesive force between two mica thin films. The contact area on the mica can be determined from the FECO fringes. A double cantilever spring is used to measure the adhesive (pull-off) forces between the two mica thin films. The usefulness of the adhesive force measurement system is validated by comparing with the result from JKR contact theory.