Measurement of elastic constants and mass density by acoustic microscopy

Yung Chun Lee, Jin O. Kim, Jan D. Achenbach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

This paper discusses a method to determine the elastic constants of solid materials from the measured velocities of leaky surface acoustic waves (SAWs), and it explores the feasibility of determining the mass density from attenuation data. For an anisotropic solid such as a cubic crystal, the direction-dependent velocity of a leaky SAW has been measured by line-focus acoustic microscopy (LFAM) for various propagation-directions. A set of elastic constants has then been determined by inverting the velocity data. For an isotropic solid, the elastic moduli have been determined from the leaky Rayleigh wave velocity measured by LFAM and a longitudinal wave velocity measured by a pulse-echo transit-time technique. In addition to determining the elastic constants, it has been attempted to use the leaky SAW attenuation data measured by LFAM to determine the mass density.

Original languageEnglish
Title of host publicationProceedings of the IEEE Ultrasonics Symposium
EditorsM. Levy, B.R. McAvoy
PublisherPubl by IEEE
Pages607-612
Number of pages6
ISBN (Print)0780312783
Publication statusPublished - 1993 Dec 1
EventProceedings of the IEEE 1993 Ultrasonics Symposium. Part 1 (of 2) - Baltimore, MD, USA
Duration: 1993 Oct 311993 Nov 3

Publication series

NameProceedings of the IEEE Ultrasonics Symposium
Volume1
ISSN (Print)1051-0117

Other

OtherProceedings of the IEEE 1993 Ultrasonics Symposium. Part 1 (of 2)
CityBaltimore, MD, USA
Period93-10-3193-11-03

All Science Journal Classification (ASJC) codes

  • Acoustics and Ultrasonics

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  • Cite this

    Lee, Y. C., Kim, J. O., & Achenbach, J. D. (1993). Measurement of elastic constants and mass density by acoustic microscopy. In M. Levy, & B. R. McAvoy (Eds.), Proceedings of the IEEE Ultrasonics Symposium (pp. 607-612). (Proceedings of the IEEE Ultrasonics Symposium; Vol. 1). Publ by IEEE.