TY - GEN
T1 - Measurement of solder joint strength and its dependence on thermal aging in freestanding and board-mounted packages using a laser spallation technique
AU - Gupta, Vijay
AU - Tian, Jun
AU - Hartfield, Cheryl
AU - Zeng, Kejun
AU - Chiu, Cheng
AU - Stierman, Roger
PY - 2004
Y1 - 2004
N2 - The continuing evolution of semiconductor packages to finer solder ball pitches, shrinking solder ball volume, and new solder materials, mandates the availability of methods to accurately assess solder joint reliability both at the component and at the board level. Many tests in use for this purpose cannot provide direct measurements of solder joint interfacial strength. This paper reports on the investigation of laser spallation for interracial strength assessments and understanding of failure mechanisms on chip scale package (CSP) solder joints.
AB - The continuing evolution of semiconductor packages to finer solder ball pitches, shrinking solder ball volume, and new solder materials, mandates the availability of methods to accurately assess solder joint reliability both at the component and at the board level. Many tests in use for this purpose cannot provide direct measurements of solder joint interfacial strength. This paper reports on the investigation of laser spallation for interracial strength assessments and understanding of failure mechanisms on chip scale package (CSP) solder joints.
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M3 - Conference contribution
AN - SCOPUS:10444272491
SN - 0871708078
T3 - Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004
SP - 267
EP - 276
BT - ISTFA 2004 - Proceedings of the 30th International Symposium for Testing and Failure Analysis
T2 - ISTFA 2004 - Proceedings of the 30th International Symposium for Testing and Failure Analysis
Y2 - 14 November 2004 through 18 November 2004
ER -