Measurement of solder joint strength and its dependence on thermal aging in freestanding and board-mounted packages using a laser spallation technique

Vijay Gupta, Jun Tian, Cheryl Hartfield, Kejun Zeng, Cheng Chiu, Roger Stierman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The continuing evolution of semiconductor packages to finer solder ball pitches, shrinking solder ball volume, and new solder materials, mandates the availability of methods to accurately assess solder joint reliability both at the component and at the board level. Many tests in use for this purpose cannot provide direct measurements of solder joint interfacial strength. This paper reports on the investigation of laser spallation for interracial strength assessments and understanding of failure mechanisms on chip scale package (CSP) solder joints.

Original languageEnglish
Title of host publicationISTFA 2004 - Proceedings of the 30th International Symposium for Testing and Failure Analysis
Pages267-276
Number of pages10
Publication statusPublished - 2004
EventISTFA 2004 - Proceedings of the 30th International Symposium for Testing and Failure Analysis - Worcester, MA, United States
Duration: 2004 Nov 142004 Nov 18

Publication series

NameProceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Other

OtherISTFA 2004 - Proceedings of the 30th International Symposium for Testing and Failure Analysis
CountryUnited States
CityWorcester, MA
Period04-11-1404-11-18

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Measurement of solder joint strength and its dependence on thermal aging in freestanding and board-mounted packages using a laser spallation technique'. Together they form a unique fingerprint.

Cite this