Measurement uncertainty in nanometrology: Leveraging attributes of TEM and CD AFM

Hao Chih Liu, Gregory A. Dahlen, Marc Osborn, Jason R. Osborne, Lars Mininni, Bryan Tracy, Amalia Del Rosario

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A new method is presented to accurately determine the exact location of a transmission electron microscopy (TEM) sample extraction site using critical dimension atomic force microscopy (CD AFM), The method entails use of the CD AFM to nondestructively pre-screen the sample, thus acquiring a "finger print" of the surface morphology in the region of interest. Following TEM sample "milling" and extraction, the acquired TEM micrograph feature measurements are matched to their CD AFM counterparts. By acquiring multiple feature profiles within the same TEM sample, the matching and "unique" TEM sample location is determined independently of scaling variation between the TEM and CD AFM metrologies. This method is then used to validate CD AFM image reconstruction algorithms in the present paper.

Original languageEnglish
Title of host publication2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)1424410800, 9781424410804
DOIs
Publication statusPublished - 2007
Event2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Synergy of Science and Technology in Instrumentation and Measurement - Warsaw, Poland
Duration: 2007 May 12007 May 3

Publication series

NameConference Record - IEEE Instrumentation and Measurement Technology Conference
ISSN (Print)1091-5281

Other

Other2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Synergy of Science and Technology in Instrumentation and Measurement
Country/TerritoryPoland
CityWarsaw
Period07-05-0107-05-03

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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