Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation

Chih Yang Chiang, Hong Yi Yan, Zhi Kai Huang, Kuo Shen Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the development of a new model for extracting elastic modulus from nanoindentation testing data and its subsequent application for deterimining the Young's modulus of plasma-enhanced chemical vapour deposited (PECVD) silicon nitride films after rapid thermal annealing (RTA), processed between 400 and 800°C. Primary test data indicate that the modulus varied significantly with different RTA temperatures. However, the traditional data reduction scheme cannot exclude the substrate effect and it results in depth-dependent modulus. In this work, the substrate effect can be significantly reduced by the proposed model and the accurate data reduction implies that it is possible to provide more understanding to accurate correlate the fabrication process parameters and the resulted mechanical behavior of thin films in the future.

Original languageEnglish
Title of host publicationTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Pages20-23
Number of pages4
Publication statusPublished - 2011 Nov 23
EventNanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 - Boston, MA, United States
Duration: 2011 Jun 132011 Jun 16

Publication series

NameTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Volume1

Other

OtherNanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
CountryUnited States
CityBoston, MA
Period11-06-1311-06-16

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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  • Cite this

    Chiang, C. Y., Yan, H. Y., Huang, Z. K., & Chen, K. S. (2011). Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation. In Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 (pp. 20-23). (Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011; Vol. 1).