Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings

Chiang Ming Chuang; Po Cheng Shih; Kwang Lung Lin

doi:10.1007/s11664-004-0286-4

Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings

Chiang Ming Chuang
, Po Cheng Shih
, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

49 Citations (Scopus)

Abstract

The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.

Original language	English
Pages (from-to)	1-6
Number of pages	6
Journal	Journal of Electronic Materials
Volume	33
Issue number	1
DOIs	https://doi.org/10.1007/s11664-004-0286-4
Publication status	Published - 2004 Jan 2

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-004-0286-4

Cite this

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title = "Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings",

abstract = "The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.",

author = "Chuang, \{Chiang Ming\} and Shih, \{Po Cheng\} and Lin, \{Kwang Lung\}",

note = "Funding Information: The financial support of this work from the National Science Council of the Republic of China (Taiwan) under Grant No. NSC91-2216-E-006-035 is gratefully acknowledged. The authors also thank Accurus Inc. for supplying the solder balls. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.",

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doi = "10.1007/s11664-004-0286-4",

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AU - Chuang, Chiang Ming

AU - Shih, Po Cheng

AU - Lin, Kwang Lung

N1 - Funding Information: The financial support of this work from the National Science Council of the Republic of China (Taiwan) under Grant No. NSC91-2216-E-006-035 is gratefully acknowledged. The authors also thank Accurus Inc. for supplying the solder balls. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.

PY - 2004/1/2

Y1 - 2004/1/2

N2 - The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.

AB - The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.

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Mechanical Strength of Sn-3.5Ag-Based Solders and Related Bondings

Abstract

All Science Journal Classification (ASJC) codes

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