Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

Original languageEnglish
Pages (from-to)5094-5106
Number of pages13
JournalJournal of Electronic Materials
Issue number8
Publication statusPublished - 2017 Aug 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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