Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Kuo Tsai Wu; Sheng Jye Hwang; Huei Huang Lee

doi:10.1007/s11664-017-5516-7

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

Original language	English
Pages (from-to)	5094-5106
Number of pages	13
Journal	Journal of Electronic Materials
Volume	46
Issue number	8
DOIs	https://doi.org/10.1007/s11664-017-5516-7
Publication status	Published - 2017 Aug 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-017-5516-7

Cite this

@article{c22b48dd2f5c4b618c012f245feef81b,

title = "Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill",

abstract = "Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.",

author = "Wu, {Kuo Tsai} and Hwang, {Sheng Jye} and Lee, {Huei Huang}",

note = "Publisher Copyright: {\textcopyright} 2017, The Minerals, Metals & Materials Society.",

year = "2017",

month = aug,

day = "1",

doi = "10.1007/s11664-017-5516-7",

language = "English",

volume = "46",

pages = "5094--5106",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "8",

}

TY - JOUR

T1 - Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

AU - Wu, Kuo Tsai

AU - Hwang, Sheng Jye

AU - Lee, Huei Huang

PY - 2017/8/1

Y1 - 2017/8/1

N2 - Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

AB - Voids have always been present using the molded underfill (MUF) package process, which is a problem that needs further investigation. In this study, the process was studied using the Moldex3D numerical analysis software. The effects of gas (air vent effect) on the overall melt front were also considered. In this isothermal process containing two fluids, the gas and melt colloid interact in the mold cavity. Simulation enabled an appropriate understanding of the actual situation to be gained, and, through analysis, the void region and exact location of voids were predicted. First, the global flow end area was observed to predict the void movement trend, and then the local flow ends were observed to predict the location and size of voids. In the MUF 518 case study, simulations predicted the void region as well as the location and size of the voids. The void phenomenon in a flip chip ball grid array underfill is discussed as part of the study.

UR - http://www.scopus.com/inward/record.url?scp=85018528747&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85018528747&partnerID=8YFLogxK

U2 - 10.1007/s11664-017-5516-7

DO - 10.1007/s11664-017-5516-7

M3 - Article

AN - SCOPUS:85018528747

VL - 46

SP - 5094

EP - 5106

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 8

ER -

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this