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MEMS Residual Stress Characterization: Methodology and Perspective
Kuo Shen Chen
, Kuang Shun Ou
Department of Mechanical Engineering
Research output
:
Chapter in Book/Report/Conference proceeding
›
Chapter
12
Citations (Scopus)
Overview
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Engineering & Materials Science
MEMS
100%
Residual stresses
93%
Stress measurement
33%
Electron-phonon interactions
27%
Thin films
25%
Fracture toughness
24%
Materials properties
22%
Film growth
21%
Phonons
21%
Carrier concentration
19%
Crystal orientation
18%
Raman spectroscopy
18%
Chemical analysis
17%
Crystal structure
17%
Electron energy levels
15%
Diaphragms
14%
Indentation
14%
Structural integrity
14%
Electrostatics
14%
Compressive stress
14%
Microhardness
13%
Impurities
12%
Buckling
11%
Characterization (materials science)
11%
Elastic moduli
11%
Hardness
10%
Mechanical properties
8%
Testing
6%
Temperature
5%