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MEMS residual stress characterization: Methodology and perspective
Kuo Shen Chen
, Kuang Shun Ou
Department of Mechanical Engineering
Research output
:
Chapter in Book/Report/Conference proceeding
›
Chapter
5
Citations (Scopus)
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Engineering & Materials Science
MEMS
69%
Residual stresses
65%
Stress measurement
23%
Electron-phonon interactions
19%
Thin films
17%
Fracture toughness
16%
Materials properties
15%
Film growth
14%
Phonons
14%
Carrier concentration
13%
Crystal orientation
13%
Raman spectroscopy
12%
Chemical analysis
12%
Crystal structure
12%
Electron energy levels
10%
Diaphragms
10%
Indentation
10%
Structural integrity
10%
Electrostatics
10%
Compressive stress
9%
Microhardness
9%
Impurities
9%
Buckling
8%
Characterization (materials science)
8%
Elastic moduli
7%
Hardness
7%
Mechanical properties
6%
Testing
4%
Temperature
3%
Chemical Compounds
Residual Stress
100%
Electron-Phonon Interaction
14%
Fracture Strength
13%
Crystal Orientation
11%
Measurement Method
11%
Fracture Toughness
10%
Phonon
10%
Microhardness
10%
Plate Like Crystal
7%
Raman Spectroscopy
7%
Dimension
7%
Electron Particle
5%
Crystal Structure
4%
Composite Material
4%
Liquid Film
4%
Energy
4%
Reaction Yield
3%