We report prototype thermoelectric microcoolers (μ-TEC) based on transport along thin- and thick-film plane using MEMS technology. Described is the fabrication processes as well as an analytic model used to design the microdevices. Si/Ge superlattice thin films grown by MBE and electrochemically deposited Bi2Te3 films are used as the thermoelectric materials in the fabrication of the μ-TEC. To reduce the heat leakage, the substrates are removed under the active region such that the cooling spots are suspended only by the thermoelectric legs. Additional heat leakage through the supporting structure and thermal radiation are considered through modeling.
|Number of pages||4|
|Publication status||Published - 2001|
|Event||20th International Conference on Thermoelectrics ICT'01 - Beijing, China|
Duration: 2001 Jun 8 → 2001 Jun 11
|Conference||20th International Conference on Thermoelectrics ICT'01|
|Period||01-06-08 → 01-06-11|
All Science Journal Classification (ASJC) codes