MEMS thermoelectric microcooler

D. J. Yao, C. J. Kim, G. Chen, J. L. Liu, K. L. Wang, J. Snyder, J. P. Fleurial

Research output: Contribution to conferencePaperpeer-review

14 Citations (Scopus)

Abstract

We report prototype thermoelectric microcoolers (μ-TEC) based on transport along thin- and thick-film plane using MEMS technology. Described is the fabrication processes as well as an analytic model used to design the microdevices. Si/Ge superlattice thin films grown by MBE and electrochemically deposited Bi2Te3 films are used as the thermoelectric materials in the fabrication of the μ-TEC. To reduce the heat leakage, the substrates are removed under the active region such that the cooling spots are suspended only by the thermoelectric legs. Additional heat leakage through the supporting structure and thermal radiation are considered through modeling.

Original languageEnglish
Pages401-404
Number of pages4
Publication statusPublished - 2001
Event20th International Conference on Thermoelectrics ICT'01 - Beijing, China
Duration: 2001 Jun 82001 Jun 11

Conference

Conference20th International Conference on Thermoelectrics ICT'01
Country/TerritoryChina
CityBeijing
Period01-06-0801-06-11

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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