Method for high aspect ratio pattern transfer

Franklin Chau-Nan Hong (Inventor), Lien-Chung Hsu (Inventor)

Research output: Patent

Abstract

The present invention relates a method for high aspect ratio pattern transfer, by using combination of imprint and Step and Flash techniques to transfer high aspect ratio pattern. The present invention simultaneously saves the developing time and the amount of developer used during the photo-resist pattern transfer process. The present invention is able to avoid separation and dissolution between pattern and substrate that is attacked by developer, and is able to yield high aspect ratio patterns.
Original languageEnglish
Patent number7063939
Publication statusPublished - 2005 Feb 3

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Hong, F. C-N., & Hsu, L-C. (2005). Method for high aspect ratio pattern transfer. (Patent No. 7063939).