Method of localized and low-temperature wafer bonding for micro-system packaging

S. C. Shen, Chengtang Pan, Hwai Pwu Chou

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

This paper presents a novel approach for bonding technique based on the concept of patternable and low temperature process. This method especially is suitable for the design of microstructure by surface micromachining. By this way, the bonding can be solved. The patternable intermediate of photoresist is applied to conduct wafer-bonding experiment. SU-8 is selected as intermediate layer the thickness of SU-8 not only can be easily controlled, but also can be patterned into any-shape by the technique. Furthermore, this method provides smooth intermediate pad to contact for bonding. The experiment of wafer-to-wafer intermediate bonding was conducted. The preliminary results show that the influences of high temperature, electric field, and void can be avoided. The tensile stress test is shown the bonding strength up to 216 kg/cm2 can be reached.

Original languageEnglish
Pages (from-to)185-192
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4407
DOIs
Publication statusPublished - 2001

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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