Microstructural characteristics and the charge-discharge characteristics of Sn-Cu thin film materials

Chao Han Wu, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


In this study, radio frequency magnetron sputtering was used to prepare Cu6 Sn5 film anodes. The effects of the thickness of the film and its index of crystallinity (IOC) on the charge-discharge capacity characteristics are discussed. Increasing the thickness of the film anode from 500 to 1500 nm, not only raised the IOC, but also improved the migration of lithium ions and electrons because of the lower resistivity. So, the cyclability of the as-adopted film was enhanced with increasing the film thickness. After recrystallization, the IOC rose and the resistivity fell. However, cracks on the film induced by thermal strain increased the area of the passive film, resulting in reduced cyclability. Also, prolonging the duration of sputtering (5000 nm) led to a deterioration in the charge-discharge capacity.

Original languageEnglish
Pages (from-to)381-387
Number of pages7
JournalMaterials Transactions
Issue number2
Publication statusPublished - 2009 Feb

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Microstructural characteristics and the charge-discharge characteristics of Sn-Cu thin film materials'. Together they form a unique fingerprint.

Cite this