Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

Teng Chun Hsuan, Kwang Lung Lin

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21 Citations (Scopus)

Abstract

This study investigated the microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ε-AgZn3 with precipitated Zn-rich became a diffusion couple. The ε-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ε-AgZn3 IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.

Original languageEnglish
Pages (from-to)350-356
Number of pages7
JournalJournal of Alloys and Compounds
Volume469
Issue number1-2
DOIs
Publication statusPublished - 2009 Feb 5

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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