Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

Teng Chun Hsuan; Kwang Lung Lin

doi:10.1016/j.jallcom.2008.01.121

Microstructural evolution of ε-AgZn₃ and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

Teng Chun Hsuan
, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

22 Citations (Scopus)

Abstract

This study investigated the microstructural evolution of ε-AgZn₃ and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn₃ intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ε-AgZn₃ with precipitated Zn-rich became a diffusion couple. The ε-AgZn₃ compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ε-AgZn₃ IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.

Original language	English
Pages (from-to)	350-356
Number of pages	7
Journal	Journal of Alloys and Compounds
Volume	469
Issue number	1-2
DOIs	https://doi.org/10.1016/j.jallcom.2008.01.121
Publication status	Published - 2009 Feb 5

All Science Journal Classification (ASJC) codes

Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

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10.1016/j.jallcom.2008.01.121

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title = "Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment",

abstract = "This study investigated the microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ε-AgZn3 with precipitated Zn-rich became a diffusion couple. The ε-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ε-AgZn3 IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.",

author = "Hsuan, \{Teng Chun\} and Lin, \{Kwang Lung\}",

note = "Funding Information: Financial support of this research from the National Science Council of the Republic of China, Taiwan under the projects NSC93-2216-E-006-011 and NSC93-2216-E-006-022 is gratefully acknowledged. The authors also thank the NCKU project of Promoting Academic Excellence \& Developing World Class Research Center: D96-2700. ",

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doi = "10.1016/j.jallcom.2008.01.121",

language = "English",

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AU - Hsuan, Teng Chun

AU - Lin, Kwang Lung

N1 - Funding Information: Financial support of this research from the National Science Council of the Republic of China, Taiwan under the projects NSC93-2216-E-006-011 and NSC93-2216-E-006-022 is gratefully acknowledged. The authors also thank the NCKU project of Promoting Academic Excellence & Developing World Class Research Center: D96-2700.

PY - 2009/2/5

Y1 - 2009/2/5

N2 - This study investigated the microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ε-AgZn3 with precipitated Zn-rich became a diffusion couple. The ε-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ε-AgZn3 IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.

AB - This study investigated the microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder (5-e alloy) during isothermal aging treatment at 150 °C. Zn element easily precipitates on the surface of AgZn3 intermetallic compounds (IMCs) and grows rapidly during aging. During aging, Ag dissolves in the precipitated Zn which forms the Zn-rich phase (η-Zn), the combination of ε-AgZn3 with precipitated Zn-rich became a diffusion couple. The ε-AgZn3 compound shrinks apparently upon heat exposure. Furthermore, at the interface of this diffusion couple, it seems to exit a phase transition between ε-AgZn3 IMC and η-Zn phase. This phase transition mechanism will be discussed in this paper.

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DO - 10.1016/j.jallcom.2008.01.121

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VL - 469

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JO - Journal of Alloys and Compounds

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ER -

Microstructural evolution of ε-AgZn₃ and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment

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