Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment

Kwang-Lung Lin, Chih Chun Hsiao, Kaug I. Chen

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The Pb-free Sn-Ag-Cu-Al solders were investigated for microstructural evolution with respect to Al% and heat treatment. The Al% varies from 0.1% to 0.45% while the contents of Ag are 3.1%-2.53% and of Cu are 0.41%-0.33%. Differential scanning colorimetry (DSC) was applied to identify the melting behavior. A monotectic temperature of 224°C and a eutectic temperature of 220°C are deduced from the DSC results. The microstructure was characterized with x-ray diffraction and scanning electron microscopy-energy dispersive spectroscopy. Ag3Sn and the γ2 phase of Al-Cu system are the intermetallic compounds formed in the as-cast solders. Cu6Sn5 formed upon heat treatment for 1000 h at 150°C in the 0.45 Al-containing solder, while not found in the other solders or other heat treatment conditions. Sn whiskers were detected in a 0.45 Al-containing specimen after aging for 50 h.

Original languageEnglish
Pages (from-to)2386-2393
Number of pages8
JournalJournal of Materials Research
Volume17
Issue number9
DOIs
Publication statusPublished - 2002 Jan 1

Fingerprint

Microstructural evolution
solders
Soldering alloys
heat treatment
Heat treatment
colorimetry
Colorimetry
Scanning
scanning
eutectics
Eutectics
Intermetallics
intermetallics
casts
Energy dispersive spectroscopy
Melting
x ray diffraction
Aging of materials
Diffraction
melting

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{a1d457543b0846f797f5efef7f98a088,
title = "Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment",
abstract = "The Pb-free Sn-Ag-Cu-Al solders were investigated for microstructural evolution with respect to Al{\%} and heat treatment. The Al{\%} varies from 0.1{\%} to 0.45{\%} while the contents of Ag are 3.1{\%}-2.53{\%} and of Cu are 0.41{\%}-0.33{\%}. Differential scanning colorimetry (DSC) was applied to identify the melting behavior. A monotectic temperature of 224°C and a eutectic temperature of 220°C are deduced from the DSC results. The microstructure was characterized with x-ray diffraction and scanning electron microscopy-energy dispersive spectroscopy. Ag3Sn and the γ2 phase of Al-Cu system are the intermetallic compounds formed in the as-cast solders. Cu6Sn5 formed upon heat treatment for 1000 h at 150°C in the 0.45 Al-containing solder, while not found in the other solders or other heat treatment conditions. Sn whiskers were detected in a 0.45 Al-containing specimen after aging for 50 h.",
author = "Kwang-Lung Lin and Hsiao, {Chih Chun} and Chen, {Kaug I.}",
year = "2002",
month = "1",
day = "1",
doi = "10.1557/JMR.2002.0349",
language = "English",
volume = "17",
pages = "2386--2393",
journal = "Journal of Materials Research",
issn = "0884-2914",
publisher = "Materials Research Society",
number = "9",

}

Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment. / Lin, Kwang-Lung; Hsiao, Chih Chun; Chen, Kaug I.

In: Journal of Materials Research, Vol. 17, No. 9, 01.01.2002, p. 2386-2393.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment

AU - Lin, Kwang-Lung

AU - Hsiao, Chih Chun

AU - Chen, Kaug I.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - The Pb-free Sn-Ag-Cu-Al solders were investigated for microstructural evolution with respect to Al% and heat treatment. The Al% varies from 0.1% to 0.45% while the contents of Ag are 3.1%-2.53% and of Cu are 0.41%-0.33%. Differential scanning colorimetry (DSC) was applied to identify the melting behavior. A monotectic temperature of 224°C and a eutectic temperature of 220°C are deduced from the DSC results. The microstructure was characterized with x-ray diffraction and scanning electron microscopy-energy dispersive spectroscopy. Ag3Sn and the γ2 phase of Al-Cu system are the intermetallic compounds formed in the as-cast solders. Cu6Sn5 formed upon heat treatment for 1000 h at 150°C in the 0.45 Al-containing solder, while not found in the other solders or other heat treatment conditions. Sn whiskers were detected in a 0.45 Al-containing specimen after aging for 50 h.

AB - The Pb-free Sn-Ag-Cu-Al solders were investigated for microstructural evolution with respect to Al% and heat treatment. The Al% varies from 0.1% to 0.45% while the contents of Ag are 3.1%-2.53% and of Cu are 0.41%-0.33%. Differential scanning colorimetry (DSC) was applied to identify the melting behavior. A monotectic temperature of 224°C and a eutectic temperature of 220°C are deduced from the DSC results. The microstructure was characterized with x-ray diffraction and scanning electron microscopy-energy dispersive spectroscopy. Ag3Sn and the γ2 phase of Al-Cu system are the intermetallic compounds formed in the as-cast solders. Cu6Sn5 formed upon heat treatment for 1000 h at 150°C in the 0.45 Al-containing solder, while not found in the other solders or other heat treatment conditions. Sn whiskers were detected in a 0.45 Al-containing specimen after aging for 50 h.

UR - http://www.scopus.com/inward/record.url?scp=0036709688&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036709688&partnerID=8YFLogxK

U2 - 10.1557/JMR.2002.0349

DO - 10.1557/JMR.2002.0349

M3 - Article

VL - 17

SP - 2386

EP - 2393

JO - Journal of Materials Research

JF - Journal of Materials Research

SN - 0884-2914

IS - 9

ER -